Sinisiguro ng Samsung ang Nvidia Deal para sa Advanced na Packaging
Sinisiguro ng Samsung ang Nvidia Deal para sa Advanced na Packaging Samsung won a giant deal with Nvidia, an elite technology company, for a more reliable packaging solution by using its AI chips coupled with HBM chips which have a higher bandwidth. The factor highlights the rising prominence of state-of-the-art packaging technologies in the microwave equipment arena. Strategic partnership unveiled According to a recent article published by the South Korean news outlet The Elec, the packaging team with the most advanced technology area will establish interposer and 2.5D packaging technology for neurological processors, which will be used by Nvidia. However, NVIDIA supplies GPU and HBM components by itself, yet it is reasonable to guess that NVIDIAs GPUs are produced by TSMC, while HBM chips are therefore designed and produced at SK Hynix. Industry experts have suggested that this partnership could be considering CoWoSs issues in getting demand fulfilled, which is believed to be a limiting factor in the technology. Although the problems in the agricultural industry can be related to the last earthquake in Taiwan, this consideration is considered the simplest point of view of supply and demand, which has a deeper contributing motive. Samsungs iCube technology iCube, which Samsungs technology firms have labeled as the